Time Domain Modeling of High-Speed Circuit Structures with TLM

W. J. R. Hoefer

IEEE 5th Topical Meeting on Electrical Performance of Electronic Packaging, pp 196-198, The Inn at Napa Valley, Napa, California, October 28-30, 1996 (IEEE #: 96TH8203)


This paper describes two important new features necessary for the efficient modeling of transient electromagnetic signals in high-speed circuit structures using the time domain Transmission Line Matrix (TLM) method of analysis. These are the accurate representation of fields in the vicinity of sharp edges, and the modeling of packages using a hybrid TLM / Mode Matching approach in the transient regime.

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