08:00 | Modeling Anisotropic Dispersive Materials in TLM | L. de Menezes and W.J.R. Hoefer | 91 |
08:20 | Modeling of Frequency Dependent Material Parameters Using TLM | I.M. Salama, W. Su and S.M. Riad | 95 |
08:40 | Interface of Nonlinear Device Models to a TLM Mesh | J. Nielsen (Invited) | 99 |
09:25 | Exploring the Capabilities of the TLM Method on Microstrip Structures Suitable for Device Integration | P.M. Frank, N.R.S. Simons, D.J. Roscoe, A. Sebak and M. Cuhaci | 113 |
09:45 | Refreshment break |
10:00 | TLM models of thermal and particle diffusion | D. de Cogan (Invited) | 119 |
10:45 | TLM Modeling of Grain-Boundary Diffusion in Thin Films with Microstructural Details | X. Gui, L.J. Friedrich, K. Dew, M.J. Brett and T. Smy | 129 |
11:05 | Link-Line Versus Link Resistor Representations in TLM Diffusion Models | A. Chakrabarti, C. Kenny, D. de Cogan and P. Enders | 133 |
11:25 | TLM Routines for the Paraxial Wave Equation and the Time-Dependent Schroedinger Equation | P. Enders and D. de Cogan | 137 |
11:45 | Lunch |